Summary
At Apple, we believe our products begin with our people. By hiring a team with varied strengths, we drive creative thought. By giving that team everything they need, we drive innovation. By hiring incredible engineers, we drive precision. And through our collaborative process, we build memorable experiences for our customers.

These elements come together to make Apple an amazing environment for motivated people to do the greatest work of their lives. You will become part of a hands-on development team that sets the standard in cultivating excellence, creativity and innovation. Will you help us design the next generation of revolutionary Apple products?

Description
We are looking for a senior level advanced packaging engineer to develop exciting new products. Your role is to interface between internal product/device design, process integration and external suppliers to develop and deploy new packaging technologies. We are looking for individuals who are very innovative with a proven track record to bring packaging solution from concept to high-volume manufacturing.

Responsibilities

• Evaluate leading edge Photonic packaging technologies including characterization and improvement to Silicon Photonic performance, yield and reliability. Define package characteristics and specification, and solve device & yield issues from NPI to mass production.
• Work with leading foundry, design house, assembly and optical suppliers on Co-package optics development from design, new material, new equipment selection and establish robust process of record. Perform initial proof of concept sample build, test vehicle validation, package and process qualification, yield and continuous improvement.
• Interface and coordinate with other packaging team members to comply with product development & ramp schedule. Deliver product milestones on time.
• Define packaging roadmap based on long term package product requirements. Work closely with suppliers and manage R&D activities.
• At least 5~10% travel to domestic and international locations.
  
  

Minimum Qualifications

• M.S or Ph.D. degree in Photonics, Physics, Materials science or similar disciplines with a minimum of 5 years of experience in high performance computing or data center applications.
• In-depth knowledge in advanced 2.5D/3D packaging for EIC/PIC die integration, Chip-on-Wafer processes, Optical component assembly and MCM module assembly.
  
  

Preferred Qualifications

• Good understanding to optics and photonics fundamentals, device/module integration.
• Knowledge in Optical device laser, modulator, photo detector, passive components is a plus.
• Proven track record to drive issue resolution with good understanding to root cause and physics, motivate and mobilize all levels within supplier to accomplish any given task. Able to perform independent research and development work with minimal supervision.
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plan with high confidence at internal or external meetings.
  
  

Apple is an equal opportunity employer that is committed to inclusion and diversity, and thus we treat all applicants fairly and equally. Apple is committed to working with and providing reasonable accommodation to applicants with physical and mental disabilities.

At Apple, we believe accessibility is a fundamental human right. You’ll find that idea reflected in everything here — in our culture, our benefits and our digital tools. By welcoming as many perspectives as possible, we help you build a career where you feel like you belong.

Learn about accessibility in Apple’s workplace

Role Number: 200624996-3950